Resolve cross-layer AGC control mismatch where opcode 0x28 only
controlled the FPGA inner-loop AGC but the STM32 outer-loop AGC
(ADAR1000_AGC) ran independently with its own enable state.
FPGA: Drive gpio_dig6 from host_agc_enable instead of tied low,
making the FPGA register the single source of truth for AGC state.
MCU: Change ADAR1000_AGC constructor default from enabled(true) to
enabled(false) so boot state matches FPGA reset default (AGC off).
Read DIG_6 GPIO every frame with 2-frame confirmation debounce to
sync outerAgc.enabled — prevents single-sample glitch from causing
spurious AGC state transitions.
Tests: Update MCU unit tests for new default, add 6 cross-layer
contract tests verifying the FPGA-MCU-GUI AGC invariant chain.
- Add set_false_path -hold for source-synchronous ADC IDDR paths in
adc_clk_mmcm.xdc (eliminates 8 hold violations from build 12)
- Add DDR falling-edge input delay constraints to xc7a50t_ftg256.xdc
(parity with 200T XDC)
- Reorganize scripts/ into target subdirectories: 50t/, 200t/, te0712/,
te0713/, utils/ so users can run the correct build for their hardware
- Delete obsolete build scripts (build17-20) superseded by build_50t/200t
- Update project_root paths in all moved scripts (.. -> ../..)
The placer enforces a single VCCO per bank. LVDS_25 forces Bank 14
to VCCO=2.5V, which conflicts with LVCMOS33 (needs 3.3V). Changing
adc_pwdn to LVCMOS25 resolves [Place 30-372] bank incompatibility.
The AD9484 PWDN pin has CMOS-level thresholds (~0.8V), so 2.5V
output drives it correctly.
Three issues prevented the 50T (FTG256) build from completing:
1. LVDS standard: LVDS_33 and LVDS do not exist on 7-series HR banks.
Changed to LVDS_25 (the only valid differential input standard).
IBUFDS inputs are VCCO-independent, so LVDS_25 works correctly even
with Bank 14 VCCO=3.3V.
2. BIVC-1 DRC: Bank 14 has LVDS_25 (needs 2.5V) and LVCMOS33 adc_pwdn
(needs 3.3V). Since all LVDS ports are inputs (IBUFDS only), the
voltage conflict does not affect functionality. Demoted to warning.
3. Pin overflow: 113 ports vs 69 available FTG256 pins. The 118
unconstrained port bits (FT601 unwired, status/debug unrouted,
dac_clk unconnected) cause NSTD-1/UCIO-1 DRC errors. Demoted to
warnings since these ports have no physical connections on this board.
Also added: CFGBVS/CONFIG_VOLTAGE settings, build_50t_test.tcl to repo.
LVDS_33 is not a valid I/O standard on 7-series FPGAs. The correct
standard for LVDS inputs in HR banks with VCCO != 2.5V is LVDS, which
works with any VCCO for input-only buffers (IBUFDS). LVDS_25 requires
VCCO=2.5V exactly.
Note: the 50T FTG256 build still fails at placement due to pin overflow
(113 ports vs 69 available pins) — this is a pre-existing package
limitation unrelated to this fix.
The IBUFDS primitives in ad9484_interface_400m.v hardcoded LVDS_25 and
DIFF_TERM TRUE, which overrode XDC constraints. On the XC7A50T (Bank 14
VCCO=3.3V), this caused a BIVC-1 DRC error: LVDS_25 requires VCCO=2.5V,
conflicting with adc_pwdn (LVCMOS33, VCCO=3.3V) in the same bank.
Changes:
- ad9484_interface_400m.v: IBUFDS parameters changed from LVDS_25/DIFF_TERM
TRUE to DEFAULT/DIFF_TERM FALSE, delegating control to XDC per target
- xc7a50t_ftg256.xdc: Re-enable DIFF_TERM TRUE (safe now that RTL does not
hardcode LVDS_25), update DRC Fix History with correct root cause
Build scripts (17-21): STATS.WNS/TNS/WHS/THS/TPWS from get_property can
return empty strings in Vivado 2025.2 after write_bitstream auto-launch.
Wrap in catch with N/A fallback. Guard all expr delta calculations and
signoff comparisons with [string is double -strict] checks.
XDC (xc7a50t_ftg256): Fix PLIO-9 by moving clk_120m_dac from C13 (N-type)
to D13 (P-type MRCC) — clock inputs require P-type MRCC pin. Fix BIVC-1 by
disabling DIFF_TERM on Bank 14 LVDS pairs to resolve VCCO conflict with
single-ended adc_pwdn (LVCMOS33) on T5 — requires external termination.
NawfalMotii79
Jason